PRESA RGA-14
Immersion Silver
(View Animation Clip)

The requirements of newer electronic parts
have caused PCBs to evolve and demand
improved manufacturing methods. One important
requirement is high-density mounting. HASL
exhibits poor thickness distribution and cannot
meet the needs of high-density mounting.

The recent emphasis on environmentally safer
products has also advanced the cause of eliminating
lead.  OSP’s formulations are not capable of preventing
copper oxidation, under the higher-temperature
assembly conditions associated with lead-free.

Uyemura's RGA Immersion Silver was developed to
meet those challenges.

Process

• Immersion silver is a simple process, with
  silver directly displacing copper in an immersion
  reaction. RGA-14 is a high productivity process.

• The RGA Immersion Silver process is compatible
  with horizontal conveyorized equipment.

Properties

• The RGA Immersion Silver deposit is uniform
  and meets thickness distribution criteria.

• Excellent shelf life with proper packaging and
  storing conditions.

• Ideal soldering surface under eutectic and
  lead-free assembly temperatures.

Plating Bath

• The Immersion Silver plating bath is
  very stable because the reaction is
  displacement-type.

• The RGA-14 bath does not decompose
  with UV light.

• Because it is a low temperature process,
  RGA-14 does not attack the substrate or
  the soldermask.

• The immersion silver deposits only on copper,
  and not on other areas (such as can be seen
  with auto-catalytic baths).

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